Primarily used as a replacement for solder in bonding applications involving heat-sensitive components or environments. Effective at bonding heat sinks to other components and PCBs. Also provides excellent EMI/RFE shielding, and very effective at filling seems between metal plates.
Liquid silver conductive epoxy
Slow cure / high conductivity (8331S)
Moderate cure / extreme conductivity (8330)
Slow cure / extreme conductivity (8330S)
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